Printed Circuit Board Assembly | PCA Technology Limited

SMT Process (RoHs Compliant) Capabilities up to: 01005 Chip Size 12 mils Integrated Circuit (IC) Pitch Micro Ball Grid Array (BGA) – Pitch 16 mils, >1000 Ball count Chip Scale Package (CSP) – Bump Diameter 0.132mm, Pitch 16 mils Flip Chip (Controlled ...

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