Contents 1. 製程原理簡介: a. 擴散Æoxidation, doping b. 薄膜ÆCVD, PVD c. 微影 d. 蝕刻Ædry, wet etching e. 化學機械研磨CMP 2. 製程整合簡介: - CMOS process flow簡介 3. 製程規格與design rule
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