Challenges in 3D NAND - Flash Memory Summit and Exhibition - August 11-13, 2015 - Sant
External Use 3D NAND: New Etch Applications STAIRCASE PATTERNING HIGH ASPECT RATIO SLITS/TRENCHES HIGH ASPECT RATIO CHANNEL FORMATION HIGH ASPECT RATIO STAIRCASE CONTACT HIGH ASPECT RATIO HARD MASK OPEN 4 TO ...
www.flashmemorysummit.com |