蔡宗勳副教授

期刊論文 T.-H. Tsai, H. Yang, R. Chein, "New electroforming technology pressure aid for LIGA process," Microsystem Technologies , 10, pp.351-356, 2004 . (SCI) T.-H. Tsai, H. Yang, R. Chein, "High-aspect-ratio microstructure filling by centrifugal force field

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